Patents and Certifications
APAQ TECHNOLOGY CO., LTD focuses on four core elements in its research and development: Basic Science Knowledge, Process Development, Properties of Functional Products, and Market Demand. The R&D process begins by understanding customer needs and downstream product applications, aiming to develop cost-competitive process technologies tailored to the characteristics of customer-required products. Over the years, in addition to collaborations with academic institutions, the company has established close partnerships with upstream and downstream suppliers, continuously enhancing the performance and technological aspects of new products to maintain a leadership position in the market.
The number of patent applications has shown a steady increase, covering areas such as soluble nano-particle solutions, capacitor encapsulation structures, methods for forming polymer composite materials on capacitor elements, capacitor structures, and manufacturing methods, winding-type capacitor encapsulation structures, solid-state capacitors, integrated circuit products, electronic products, and capacitor encapsulation technologies, among others.
| Name | Patent Office | Download |
|---|---|---|
| Capacitor Testing System and Active Pin Module | CN-Invention | File |
| Capacitor Package Structure Without Negative Foil | CN-Invention | File |
| Low Leakage Electrolytic Capacitor | CN-Invention | File |
| Capacitor Package Structure | CN-Invention | File |
| Multilayer Stacking Equipment and Film Capacitor Method | CN-Invention | File |
| Multilayer Stacking Equipment and Film Capacitor Method | CN-Invention | File |
| Lithium Battery Structure and Negative Foil | CN-Invention | File |
| Capacitor Package and Manufacturing Method | CN-Invention | File |
| Conductive Polymer Dispersion and Capacitor Package | CN-Invention | File |
| Wound Capacitor Component Structure Strength Method | CN-Invention | File |
| Wound Capacitor Package and Method | CN-Invention | File |
| Wound Capacitor Package and Seal | CN-Utility | File |
| Stacked Solid Electrolytic Capacitor and Method | TW-Invention | File |
| Capacitor Testing System and Stress Release Pin Device | TW-Invention | File |
| Color Changing Capacitor Package and Case Structure | TW-Invention | File |
| Film Capacitor and Method | TW-Invention | File |
| Stacked Solid Capacitor Package and Method | TW-Invention | File |
| Stacked Solid Capacitor Improved Welding Method | TW-Invention | File |
| Solid Capacitor Package Improved Electrical Performance | TW-Invention | File |
| Polymer Composite and Capacitor Package Method | TW-Invention | File |
| Capacitor Package and Antioxidant Composite Electrode Foil | TW-Invention | File |
| Conductive Polymer Dispersion and Capacitor Package | TW-Invention | File |
| Shield Film and Manufacturing Method | TW-Invention | File |
| Functional Coating Capacitor Package and Method | TW-Invention | File |
| Soluble Nano Particles Solution and Capacitor Package | TW-Invention | File |
| Printable Conductive Paste Capacitor and Method | TW-Invention | File |
| Wound Capacitor Component Structure Strength Method | TW-Invention | File |
| Capacitor Package and Manufacturing Method | TW-Invention | File |
| Capacitor Component Structure and Method | TW-Invention | File |
| Capacitor Unit and Manufacturing Method | TW-Invention | File |
| Wound Capacitor Package and Method | TW-Invention | File |
| Capacitor Package and Antioxidant Composite Electrode Foil | TW-Invention | File |
| Forming Polymer Composite on Capacitor Element Method | TW-Invention | File |
| Capacitor Component Package and Method | TW-Invention | File |
| Wound Capacitor Package and Method | TW-Invention | File |
| Wound Capacitor Package and Method | TW-Invention | File |
| Electrolytic Capacitor Preparation Method | TW-Invention | File |
| Stacked Solid Capacitor IC and Electronic Product | TW-Invention | File |
| Capacitor Unit and Manufacturing Method | TW-Invention | File |
| Manufacturing Electrolytic Capacitor Method | TW-Invention | File |
| Conductive Adhesive Method and Capacitor Unit Method | TW-Invention | File |
| Stacked Capacitor Component and Package Method | TW-Invention | File |
| Wound Capacitor Package | TW-Utility | File |
| Wound Capacitor Package and Seal | TW-Utility | File |
| Stacked Solid Capacitor and Method | U.S.-Invention | File |
| Stacked Solid Capacitor With Multiple Leads | U.S.-Invention | File |
| Plate Stacked Solid Capacitor | U.S.-Invention | File |
| Solid Capacitor With Protection Structure Method | U.S.-Invention | File |
| Stacked Solid Capacitor With Multiple Lead Terminals | U.S.-Invention | File |
| Capacitor Unit and Stacked Solid Capacitor | U.S.-Invention | File |